BOOTH MODEL “EE 130” TO TEST ELECTRONIC CIRCUITS
Gilardoni, in collaboration with Eidosolutions, recently produced a new radioscopy booth model for testing electronic circuits and components. The apparatus is made up of a completely shielded booth and has a microfocus x-ray source with a focal spot dimension of 16-50 µm and a voltage of up to 130 kW.
The receiving sensor is a CIMOS digital panel with 75 µm pixels. The component to be inspected is placed on a radio-transparent plate that sticks out of the booth to facilitate loading/unloading. The process can also be carried out by a robot that interfaces with the software manager. The testing is carried out by an internal manipulator with semi-spherical movements in order to analyse the component from all angles.
An external console permits managing the entire system through switches, buttons and an ergonomic mouse. User interface is simple and intuitive.
BOOTH
- External booth dimensions LxWxH: 1600x1880x1950mm
- Operational area LxWxH: 1150x600x1550mm
- Booth weight: 2.000Kg
- Loading door size LxH: 680x260mm
- Loading table dimension: 500x500mm
- Maximum loading weight: 5Kg
- Maximum component height for loading: 200mm
- Geometric enlargement range: from 2 to 20 times
MANIPULATOR
- Number of axes: 5
- X and Y axes run (loading table orthogonal translation): 500mm
- Z axis run (enlargement): 250mm
- Tx and Ty axes run (grade): ±40°
RX SYSTEM
- Maximum voltage: 130kV
- Maximum current: 300µA
- Maximum power: 39Watt
DATA ACQUISITION SYSTEM
- Technology: CMOS digital sensor
- Pixel size: 75µm
- Testing area: 114x64mm
POWER SOURCE
- Line: 230V 50/60Hz 1F+N+PE
- Power: 4kVA
- Air pressure: 6bar
